Low Temperature Effusion Cell

Low Temperature Effusion Cell (LTEC)

Key Features 

  • Max. operation temperature 1000 °C 
  • Temperature stability better than ±0.1 °C 
  • Excellent uniformity up to 60cc  
  • Single Ta-filament. 

The Low Temperature Effusion Cell (LTEC) is used to deposit a wide range of materials with a high vapour pressure (e.g. Li, Mg, Bi…) for molecular beam epitaxy (MBE). The LTEC features a patented flat foil Tantalum filament that minimizes the temperature difference between the crucible and the filament. The filament design has many benefits: 

  • Better thermal load distribution 
  • Rigid design, deformation limited. 
  • No magnetic field due to the opposing coils compensating each other. 
  • The top connecting ring can be designed so that the crucible orifice may be hotter than the crucible body, improving beam quality. 

 

Available crucible capacities are 6cc, 13cc, 20cc, 23cc, 40cc, 60cc, but bigger crucible sizes are essentially possible. Both conical and bottle neck crucible designs are available. The cell is technically identical to STEC except that the filament only surrounds the top section of the crucible. 

Product Accessories 

  • Temperature control package  
  • TDK Lamba power supplies, 
  • K-type or C-type bakeable thermocouple cables 
  • Eurotherm PID controller 
  • Bakeable water-cooling lines 

Specifications

FeatureLTEC
Volume*6 – 60 cc
Max. operating temperature1000 °C
Max. outgassing temperature (max. 30 min)1100 °C
Temperature stabilityBetter than ± 0.1°C
Max. temperature ramp rateUp to 100 °C/min
ThermocoupleK- or C-type
Cooling water flow**> 0.5 l/min, max 30 °C
Mounting flange***Customizable

 

*Technically possible to get same sizes as with the STEC

**If equipped with water-cooling shroud.

***Depends on the cell volume and available chamber port.

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