About Us
UHV thin film deposition is our business!
DCA Instruments manufactures ultra-high vacuum (UHV) systems and components for Molecular Beam Epitaxy (MBE), Physical Vapor Deposition (PVD) and Pulsed Laser Deposition (PLD). Since the company was founded in Turku (Finland) in 1989, DCA has installed more than 300 UHV systems around the world.
Pioneering Innovation
DCA pioneered the first automated UHV wafer transfer tool in 2004, becoming established as leaders in the field of UHV technology. With 35 automated wafer transfer systems deployed globally and the earliest models still operational after 20 years, our commitment to quality and reliability is evident.
Leading-Edge Technology
DCA Instruments is at the forefront of technological advancements in thin film deposition, with notable achievements including:
- Hybrid-MBE for 8″/200 mm Wafers: Expanding the versatility and capability of MBE systems.
- High-Temperature K-Cell for Titanium: Enhancing material growth options for demanding applications.
- 12″/300 mm Substrate Manipulator for Production MBE: Revolutionizing the scalability of MBE technology.
- SEMI-Fab compatible MBE systems with EFEM: ultra-low particle processing now available!
SEMI-Fab Compatibility
We take pride in our fully automated systems equipped with EFEM for 300-mm/12″ FOUP cassettes. This integration has made MBE technology fully SEMI-Fab compatible, marking a significant milestone in the evolution of our industry.
At DCA Instruments, we are dedicated to providing high-quality, reliable systems that deliver outstanding performance, ensuring our clients remain at the cutting edge of material growth technology.
DCA is the world leader in oxide MBE
World leader in Oxide MBE Systems
DCA Instruments has systematically developed oxygen resistant substrate heating and oxygen resistant sources since 1993. Proven high-performance is why leading laboratories around the world have chosen DCA oxide technology for both R&D and epiwafer production.
DCA is committed to continuous innovation, developing new sources and MBE components that push the boundaries of advanced compound semiconductor epitaxy. Our UHV system range is designed to meet diverse needs, from small R&D setups accommodating 10 mm x 10 mm sample sizes to multi-wafer configurations supporting 3 x 8″ or single-wafer 12″/300 mm production capabilities.
