Production Manipulator
Production Manipulator
Key Features
- First UHV manipulator for 300 mm /12″ silicon wafers
- Excellent thermal uniformity
- No wafer bowing or warp effect
- Reliable performance and low maintenance
- Multi-wafer capability up to 3×8”/200 mm
Robust and reliable performance is a high priority for production systems as long growth campaigns are key for a successful business. That is why DCA prioritises quality control with rigorous testing as an integral part of our manufacturing process of all component parts and assemblies.
Delivering high-quality growth is key for breakthrough results that allow cutting-edge technology to be achieved. This means minimising the presence of defects and contamination from all areas of the system including the manipulators.
Excellent thermal uniformity is critical for all growth processes and requires multiple heating zones to ensure the best possible performance. The intelligent design of these heating elements is the key to our success for delivering outstanding performance. Each heating zone includes a thermocouple that allows careful calibration and control across the entire wafer region.
As part of the automated transfer in production systems, the motion is fully motorised and can be programmed as part of the recipe process. System interlocks ensure safe operation and protect the manipulator in the event of error conditions (e.g. power loss, increased pressure).
Specifications
Feature | Specifications |
Substrate size | 4×4”/100 mm, 3×8”/200 mm, 4x 6”/150 mm, 8″/ 200 mm 12″/300 mm Custom |
Mounting flange | DN450CF or DN400CF |
Heater element | Silicon Carbide (SiC) Pyrolytic boron nitride/ pyrolytic graphite (PBN-PG) Graphite (Sig-G) Ta-Wire |
Thermal Uniformity | Better than ± 3 °C (excl. 5mm edge) |
Temperature | Eurotherm PID controller (programmed) 900 °C (@ 5E-5 Torr) 1000 °C (UHV @ Si Surface) 1150 °C (UHV @ TC) |
Motion | Motorised continuous rotation: 0.1 – 60 rpm Motorised linear z-motion (fork) – automated |
Power | LEMO connectors DC power supplies for inner and outer filaments |
Water-cooling | Integrated to top flange Internal cooling for contacts Bakeable water-cooling lines |