Automated Transfer System

Key features

Chosen by leading semiconductor manufacturers to deliver unbeatable reliability and performance.
Capable of handling 300 mm/12″ single wafer or 3 x 8”/200 mm multi-wafer carriers.
Intelligent design with precision assembly offers exceptional transfer accuracy.

DCA pioneered the first automated wafer transfer tool for UHV applications in 2004, and is established as the leaders in UHV transfer technology. With 35 automated wafer transfer systems deployed globally and the earliest models still fully operational after 20 years, our commitment to quality and reliability is evident.

Our continuous development and extensive experience with automated transfer is why DCA Instruments is the trusted supplier for production systems across the globe.

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The automated transfer system (ATS) is comprised of:

Central Distribution Chamber (CDC)

- CDC1000 (suitable for up to 12”/ 300 mm wafers)
- CDC1500 (suitable for up to 3×8”/4×6” carriers)
- Heating jacket with controller for baking up to 180 °C

Wafer-handling robotic assembly mounted in the CDC base, featuring:

- Magnetically coupled rotation and translation drives
- Robot arms with an end effector for picking/placing the wafer/carrier
- X-Y adjustment table

Load Lock Chamber (LL-C)

- Quartz lamp heater degasses wafers/carriers up to 200 °C
- IR sensor for sample ID
- Sample Cassette

- - Capacity for up to 10 wafers/carriers (removable)
  - Capacity for up to 25 wafers/carriers (non-removable)

- Pumping system

Storage Chamber (ST-C) – Optional

- Sample cassette with capacity for up to 20 (>4”) / 25 (12”) wafers

Loading tool (for production systems) enables cassette loading of ≥ 300 mm wafers.

DCA’s logic control software is customised for each system to ensure reliable operation. Extensive factory testing ensures any potential errors are eliminated and allows for quick system start-up at the customer site. System interlocks are an integral part of all DCA systems; these ensure the safety of the user as well as the system in the event of any error/emergency conditions.

Special features

Production systems that require ultra-low particle generation to achieve the highest-quality materials would benefit from integrating an Equipment Front Entry Module (EFEM) to the tool. This allows the FOUP loading system to be used allowing Tier 1 SEMI FAB compatibility. Contact us for more information about this feature.

Technical specifications

Specification	CDC1000	CDC1500
Base pressure	< 3 x10^{-10 Torr}	< 3 x10^{-10 Torr}
Pumping system	Ion pump 500L/s & TSP	Ion pump 800L/s & TSP
Bakeout temperature	180 °C	180°C
Chamber diameter	1000 mm	1500 mm
Transfer port configuration	Up to 8 (4” wafer) Up to 6 (12” / 300 mm wafer)	Up to 8 (4” wafer) Up to 5 (3×8” wafer)
Included safety interlocks	Motion, Power, Pressure	Motion, Power, Pressure
PCC communication	TCP/IP	TCP/IP

Automated Transfer System

Automated Transfer System