Substrate Manipulator

Robust and reliable performance is essential for long growth campaigns and optimal efficiency of the system. DCA manipulators are equipped with; 

• A magnetically coupled direct rotary drive for true UHV operation. 
• Water-cooled thermal contacts.  
• Shielding to protect internal wiring.  
• Coated bearings to guarantee smooth motion and long-lasting performance. 

Excellent thermal uniformity of the wafer is equally important for high quality material growth.  

Each heating element is carefully designed for the specified wafer size. The following heater elements are available: 

• Silicon carbide (SiC). 
• Pyrolytic-graphite encased in pyrolytic. boron nitride (PBN-PG). 
• Titanium.  
• Graphite. 

• Laser heater. 

The wafer size/distribution determines whether a single- or a dual-zone heater element provides optimal thermal uniformity. Both SiC and PBN-PG materials offer excellent thermal stability and temperature uniformity across the wafer.
Contact us for advice on which heater element is most suitable for your process.  

The manipulator stage for transferring and supporting the wafer/carrier is dependent on the method of transfer:  

• For automated transfer systems – a fork design allows simple and quick transfer between the robot end effector and the process chamber.  
• For manual transfer systems – a bayonet design provides secure transfer to/from the linear transfer arm.