S-Series
S-Series UHV Sputtering for R&D
Ultra-high-vacuum (UHV) magnetron sputtering (base pressure < 5 × 10⁻¹⁰ Torr) is ideally suited to high-purity, high-precision thin-film growth, where minimising substrate contamination and the incorporation of unwanted species is critical. This capability is particularly important for emerging materials systems such as novel magnetic materials, spintronic devices, high-temperature superconducting nitrides, and quantum devices (e.g. BTO).
Key features:
- true UHV compatibility
- bakeout up to 200°C
- base pressure in the low 10-10 Torr range
- excellent growth uniformity
- high flexibility for customization
The S-Series combines traditional features from conventional sputtering, such as:
- high deposition rates & uniformity and with great adheasion
- the suitability for almost any materials (including organic and magnetic materials)
- a high degree of growth control
with:
- low level of contamination
- low risk of oxidation
- excellent film uniformity
- very high purity
- very sharp interfaces
UHV sputtering enables the addition of In-Situ Analysis, while maintaining minimal residual gas contamination. This results in an extended mean free path for sputtered atoms, significantly reducing oxidation risks. As a result, UHV sputtering produces exceptionally pure films with unparalleled uniformity, ensuring sharp interfaces and facilitating the development of advanced (magnetic) materials.
Applications include oxide materials for quantum devices (such as BTO), magnetic films, spintronics, high-temperature superconductors (e.g., NbN, TiN, ZrN), and innovative research-grade multilayers.
System overview
The S-Series, for ‘research’, features a compact chamber that is perfect for space-limited laboratory environments. Despite its size, it includes all essential ports for sources, analytical components, pumping, and sample manipulation. For a simple and cost-effective solution, an optional load lock allows direct transfer to the process chamber. Additionally, intermediate buffer and degas chambers can be incorporated.
The system is fully bakeable to over 200°C without the need for counter cooling or disassembly, and it achieves a base pressure in the low 10⁻¹⁰ Torr range.
S-Series (R&D) at a glance:
- Flexible multi-chamber system design for research purposes and up to 4″ (100 mm) substrate size:
- S500 ORIGIN System – 8 source ports
- S500 FLEX System – 6 source ports and a port for an E-Beam evaporator
- Top-down or bottom-up sputtering:
- Confocal design for co-deposition
- FTS (Facing Target Sputtering for e.g. organic materials)
- Substrate manipulator:
- Substrate sizes up to 4″ (100 mm)
- Heating up to 1000 °C
- Rotation up to 60 rpm
- Tilting, Cooling, Wedge Shutters and customized variants available
- With DC, RF or magnetic bias
- Manufactured from high temperature resistant materials and compatible with oxygen
- Magnetron operation:
- DC (typical for materials with high melting point)
- RF (for insulating materials, prevents charge build-up at target)
- Pulsed DC (for reactive sputtering and materials with high impedance)
- HiPIMS (for e.g. materials with high microstructure)
- True UHV compatibility (200°C bakeout and base pressure in the low 10-10 Torr)
- Manual sample transfer with UHV cluster tool
- Wafer transfer from Transfer Chamber / Buffer Chamber / Sample Storage / Loadlock
- Hybrid systems available when combined with MBE, E-Beam or PLD
Contact us please to discuss your system and process requirements in more detail.
Specifications
| S500 ORIGIN | S500 FLEX | |
| Chamber Diameter | 500mm | |
| Bakeout temperature | 200°C | |
| Base pressure | < 5 x10-10 Torr | |
| Pump configuration | Turbo Molecular / Cryo Pump and regulated throttling valve (downstream pressure control) | |
| Sputter Magnetron source ports | 8 x CF100 (confocal) 1 x CF150 (vertical, centered) | 6 x CF100 (confocal) 1 x CF150 (vertical, centered) |
| Electron Beam source port | – | 1 x CF200 (horizontal) |
| RHEED ports | CF40 (source), CF63/100 (screen) | |
| Gauging, RGA, Ellipsometry ports | CF40 | |
| QCM, BFM, Optical ports | CF63 | |
| Atom Absorption ports | optional (2x CF16) | |
| Viewport | CF100 (with manual rotary shutter) | |
| Top flange (Wire Sealed) | Manipulator (CF150), Viewports (3x CF63) | |
The number of connection ports depends on the source configuration and can be tailored to the customers requirements.
