Wafer Flip Stage (manual/automated)
Wafer Flip Stage (manual / automated)
Key features
- flip wafers by 180° (i.e. change orientation)
- for wafers without carriers or wafer rings/holders up to 4″
- manual or fully automated operation
- true UHV compatible (< 3 x 10-10 Torr)
- fully integrated into DCAs automated transfer systems
Wafer flip stages are needed when the deposition direction needs changing from bottom up (e.g. MBE, PVD, Sputtering) to top down (e.g. Hybride MBE, CVD) or vice versa.
DCA has developed a high precision fail-safe wafer flip stage that can be operated either manually or fully automated. Great care has been taking to avoid any contamination during the flipping process as this is an important step in the process.
The automated flip stage integrates completely with the CDC robot solution and can be arranged on the side of a Preparation/Outgassing chamber. It will take the wafer e.g. from the outgassing manipulator, then flip and return it.
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Specifications
| Wafer Sizes: | up to 4″ |
| Mounting Flange | CF150 |
| Mounting Orientation: | horizontal |
| Operation: | manual or fully automated |
| Compatibility: | wafer with or without carrier ring |
| Vacuum: | true UHV: < 3 x 10-10 Torr |
How it works ...
- QCM is retracted for sample transfer
- Manipulator stage is lowered to transfer position
- Automated robot transfer arm loads the wafer into the manipulator
- Manipulator is raised and transfer arm retracted
- Manipulator stage is rotated 90 degrees to the flip stage transfer position, then lowered and the flip stage extended to collect the wafer
- Manipulator stage lifts and flip stage collects the wafer
- Retraining clamp move from right to left (clamp the wafer and transfer plate to flip stage)
- Flip stage is retracted and rotated
- Flip stage is reinserted into transfer position, the manipulator collects the wafer and raises back
- Flip stage is retracted to its storage position
