Linear Magnetron Source (APEX-L)
UHV Linear Magnetron Sputtering Source (APEX-L)
Key features
- Magnetic & Reactive Sputtering: Quantum Devices (BTO), Spintronics, Semiconductors, High TC superconductors (Nitrides)
- Large Area Deposition: Ideal for very large substrates with 8“/200mm or 12″/300mm
- Excellent Uniformity: +/-1 % Titanium (200mm wafer)
- Ultimate Cleanliness: fully UHV compatible
- High Target Utilization
- System Integration: DCA: S-Series Systems / 3rd party
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More details
Magnetron sputtering allows the deposition of even very high melting point materials, with high film adhesion and deposition rates compared to Effusion Cells. The APEX-L has been developed for optimized erosion and uniformity, for large production wafers. The unique all-metal design and SmCo magnet array ensure the magnetron is bakeable to above 200°C without counter cooling, for true UHV (< 5×10-10 Torr) base pressure operation after bakeout, hence delivering ultimate performance.
A true UHV magnetron enables the operator to combine other UHV technologies into a larger deposition system with techniques such as MBE, PLD and Surface Analysis.
UHV base pressure also helps to minimize substrate contamination and incorporation of undesirable species into a coating, a key challenge for novel magnetic and quantum devices.
For more than 30 years DCA Instruments have specialized in customized UHV thin film systems incorporating an array of deposition sources, including sputtering. Our historical expertise has enabled us to develop a new range of sources designed to meet the needs of the modern researcher exploring new materials systems and developing quantum devices.
The APEX-L magnetron sputter sources are such a new generation of bespoke designed UHV high precision sources, integrating perfectly into DCAs S-Series Sputter Systems.
Specifications
| Base Pressure: | < 5×10-10 Torr |
| Mounting Flange: | CF350 |
| Target-Sample Distance Adjustment: | optional (motorized) 150mm linear z-shift |
| Bakeout Temperature: | 200°C (without counter cooling) |
| Magnet array: | dual magnet, isolated from water supply |
| Target Size: | 50 mm x 200 mm (w x l) |
| Target Thickness: | 3 mm to 6mm |
| Gas Feed: | Integrated (for higher target & lower chamber pressures) |
| Shutter: | source flange mounted flip style shutter |
| Max. Power: | 1000 W DC, 300 W RF |
| Power Density: | typ. 3 W / cm2 |
| Power Supply / Operation Mode: | DC, RF, Pulsed DC (unipolar, bipolar), HiPIMS |
| Cooling: | water > 0.5L/min. @ 2bar (30 psi) |
