About Us
UHV Thin Film Deposition is our Business!
DCA Instruments designs and manufactures ultra-high vacuum (UHV) systems and components for Molecular Beam Epitaxy (MBE), Physical Vapor Deposition (PVD), and Pulsed Laser Deposition (PLD). Since its founding in 1989, more than 300 UHV systems have been installed worldwide.
Pioneering innovation
Expertise in UHV technology led to the introduction of the world’s first automated UHV wafer transfer tool in 2004, establishing a leadership position in the field. Today, over 35 automated wafer transfer systems are in operation globally, with several continuing to perform reliably after more than 20 years—demonstrating long-term quality and reliability.
Leading-edge technology
Continued innovation in thin-film deposition has resulted in a range of industry-leading developments, including:
- Hybrid-MBE for 8″/200 mm Wafers: expanding system versatility and capability.
- High-Temperature K-Cell for Titanium: enabling advanced material growth.
- 12″/300 mm Substrate Manipulator for Production MBE: advancing scalability.
- SEMI-Fab compatible MBE Systems with EFEM: delivering ultra-low particle processing.
SEMI-Fab compatibility
We take pride in our fully automated systems equipped with EFEM for 300-mm/12″ FOUP cassettes. This integration has made MBE technology fully SEMI-Fab compatible, marking a significant milestone in the evolution of our industry.
Ongoing expertise ensures reliable, production-ready solutions that support customers in leading advancements in material growth technology.
Quality assurance
DCA Instruments is committed to meet the highest quality manufacturing standards. We are ISO 9001:2015 approved.
DCA is the world leader in oxide MBE
World leader in oxide MBE systems
Since 1993, DCA Instruments has systematically advanced oxygen-resistant substrate heating and source technologies. This proven high performance has led leading laboratories worldwide to adopt its oxide technology for both research and development and epiwafer production.
With a strong commitment to continuous innovation, the company develops new sources and MBE components that push the boundaries of advanced compound semiconductor epitaxy. Its ultra high vacuum (UHV) system portfolio is designed to address a broad range of requirements—from compact R&D systems accommodating 10 mm × 10 mm samples to multi-wafer platforms supporting 3 × 8″ or single-wafer 12″ / 300 mm production.
